The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.
COVERAGE INCLUDES:
Ultrasonic bonding systems and technologies, including high-frequency systems
Bonding wire metallurgy and characteristics, including copper wire
Wire bond testing
Gold-aluminum intermetallic compounds and other interface reactions
Gold and nickel-based bond pad plating materials and problems
Cleaning to improve bondability and reliability
Mechanical problems in wire bonding
High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds
Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
Wire bonding process modeling and simulation
Wire Bonding in Microelectronics, 3 Edition (ReUp)
Labels: Electronics